Lower power, lower cost, and accessible to every innovator. Unlocking semiconductor future for robotics, edge AI, and autonomous systems.
The chiplet revolution promised fast time to market — but stalled at the cost barrier.
A patented, 100% digital architecture built for the real world — not just the data center. One architecture, any node, every foundry, no compromises. We offer a free MPW license if developing chiplet with us.
Architected from the ground up for extreme efficiency and density.
Compared to standard UCIe solutions, dramatically reducing die footprint and silicon cost.
Unmatched power consumption — less than 0.1 picojoules per bit transferred across chiplets.
Universal compatibility across foundries, from legacy mature nodes to cutting-edge processes.
Democratizing custom chiplet design for startups, researchers, and creators.
Traditional NRE costs for custom chiplet designs often exceed $10M — pricing out startups, researchers, and independent inventors entirely. YorChip slashes NRE costs by an order of magnitude down to around $1M leveraging PACE chiplets and Universal PHY. All with advanced packaging included!
We support multiple foundries and nodes with our digital PHY. By owning the whole stack from design through packaging we can ensure optimal power, lowest cost and power. And an ecosystem for ready to buy chiplets helps lower risk, lead-times and time to market.
Developing off-the-shelf chiplets so you don't have to.
P.A.C.E. is a collaborative powerhouse — launched with leading industry partners to co-develop IP and chiplets that accelerate Physical AI deployment across industries.
Physical AI demands localized, low-latency processing — in robots, drones, and autonomous vehicles. YorChip's PHY is purpose-built to thrive in these demanding edge environments.
Every metric tells the same story — outperforming legacy approaches across the board.
Built-in reliability and up to wafer-scale integration.
Ensures Known Good Die (KGD) qualification and enables real-time redundancy — critical for high-reliability deployments in critical Physical AI systems.
Patented packaging solution allows integration of UCIe, HBM, LPDDR and all common PHY interfaces, passives with optional cooling built-in for maximum integration support.
Three streamlined steps from concept to production.
Use existing Open Chiplets to skip costly verification cycles and start physical integration immediately.
Access regular MPW runs on mature nodes for faster qualification and earlier revenue generation.
Work directly with YorChip to transition your custom ASIC from concept to production — without delay.
The future of silicon is modular, cost-effective, and accessible. Whether you're an IP designer, SoC architect, or startup — YorChip's platform is ready for your vision.
Integrate your IP into the P.A.C.E. ecosystem and reach a global audience of modular chiplet builders.
Build next-generation chiplet-based systems with proven, production-ready universal PHY.
Innovate without the $10M barrier — get to market faster with lower cost and with best in class advanced packaging.
Reach out to our team today and discover how YorChip powers the Physical AI Age.